Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

Authors

1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia

2 School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia

3 Intel Technology Sdn. Bhd, Kulim Industrial Technology Park, Kedah, Malaysia

Abstract

The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. The simulation results in the FSI study is well validated with experimental setup. The epoxy moulding compound (EMC) and structure (chip) interaction is analyzed for better understanding the FSI phenomenon.Von Mises stresses experienced by the chip also be monitored for risk of chip cracking. The proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3D integration packages.

Keywords

Journal of Applied Fluid Mechanics
Volume 10, Issue 6
November 2017
Pages 1799-1811

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